| Items | Single/Double-sided Board/MultIlayer Board/FPC ( 1-12 Layer ) | ||
|---|---|---|---|
| Base Materials | FR-4 (High TG 150°,170°), CEM-3, BT-94V0 | ||
| Finish copper thickness | Outer 6 OZ, Inner 4 OZ | ||
| Surface Finish | ENIG, ImAg, ImSn, OSP, HASL, Plating gold. | ||
| Finished Board Size | Max Double-sided Board | 640 mm X 1100mm | |
| Max Multiplayer Board | 640 mm X 1100mm | ||
| Finished Board Hole Size(PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
| Conductor Width and Spacing | Min Conductor Width | 0.1mm | |
| Min Conductor Spacing | 0.1mm | ||
| Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
| Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
| Nickel/Gold Thickness | For customer special need | ||
| Nickel Plating Layer | >2um | ||
| Gold Plating Layer | >0.3um | ||
| Bare Board Test | Single Site Test | Max Test Point | 20480 |
| Max Board Test Size | 400mmx300mm | ||
| Double Side Test | Max Test Point | 40960(General Use) | |
| 4096(Special Use) | |||
| Max Board Test Size | 406mm x 325mm | ||
| 320mm x 400mm | |||
| Min Test pitch of SMT | 0.5mm | ||
| Test Voltage | 10-250v | ||
| Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
| Angle Tolerance | ±5° | ||
| Deepness Tolerance | ±0.20 mm | ||
| V-Cut Angle | 20°, 30°, 45° | ||
| Board Thickness | 0.1-3.2 mm | ||
| Residues Thickness | ±0.025 mm | ||
| Cell Paraposition Precision | ±0.025 mm | ||
| Tolerance of Out-shape Process | ±0.1 mm | ||
| Board Warp | Max Value | 0.7% | |
| Optical Plotting | Max Plotting Area | 660 mm X 558.8 mm | |
| Precision | ±0.01 mm | ||
| Repetitive Precision | ±0.005 mm | ||
